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    IPC 8701 Final Acceptance Criteria Standard for PV Modules-Final Module Assembly standard by Association Connecting Electronics Industries, 06/01/2014 Full Description IPC-8701 presents acceptance guidelines for the solar panel in final module assembly. The intent of...

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    IPC HDBK-630 Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures standard by Association Connecting Electronics Industries, 06/01/2014 Full Description This standard is the companion document to IPC-A-630. IPC-HDBK-630 is an in-depth...

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    IPC J-STD-003C-WAM1 Solderability Tests for Printed Boards with Amendment 1 standard by Association Connecting Electronics Industries, 05/01/2014 Full Description J-STD-003C prescribes test methods, defect definitions and illustrations for assessing the solderability of...

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    IPC 4101D Specification for Base Materials for Rigid and Multilayer Printed Boards standard by Association Connecting Electronics Industries, 04/01/2014 Full Description This specification covers the requirements for base materials that are referred to as laminate or...

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    IPC 1755 Conflict Minerals Data Exchange Standard standard by Association Connecting Electronics Industries, 03/01/2014 Full Description The IPC-1755 Conflict Minerals Data Exchange establishes a standard reporting format for exchange of information between supply chain...

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    IPC J-STD-030A Selection and Application of Board Level Underfill Materials standard by Association Connecting Electronics Industries, 02/01/2014 Full Description This document provides users of underfill material with guidance in selecting and evaluating underfill...

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    IPC 1752A-WAM1-2 Materials Declaration Management with Amendments 1 & 2 standard by Association Connecting Electronics Industries, 02/01/2014 Full Description IPC-1752A establishes a standard reporting format for material declaration data exchange between supply...

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    IPC 4103A-WAM1 Specification for Base Materials for High Speed/High Frequency Applications with Amendment 1 standard by Association Connecting Electronics Industries, 01/01/2014 Full Description This specification covers the requirements for clad and unclad plastic...

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    IPC 9706 Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection standard by Association Connecting Electronics Industries, 12/01/2013 Full Description This document establishes metrology...

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    IPC 9709 Test Guidelines for Acoustic Emission Measurement during Mechanical Testing standard by Association Connecting Electronics Industries, 11/01/2013 Full Description Surface mount pad cratering typically initiates prior to detection by existing electrical...

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    IPC 4204A with Amendment 1 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry standard by Association Connecting Electronics Industries, 10/01/2013 Full Description This standard establishes the classification system, the qualification...

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    IPC J-STD-003C Solderability Tests for Printed Boards standard by Association Connecting Electronics Industries, 09/01/2013 Full Description J-STD-003C prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface...

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Showing 1249 - 1260 of 1263 items