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    IPC WP-116 Guidance for the Development and Implementation of a Foreign Object Debris (FOD) Control Plan standard by Association Connecting Electronics Industries, 12/01/2015 Full Description Guidance to control and mitigate risks associated with the introduction of...

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    $73.92 $168.00 -56% In stock
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    IPC HDBK-4691 Handbook on Adhesive Bonding in Electronic Assembly Operations standard by Association Connecting Electronics Industries, 11/01/2015 Full Description This handbook assists individuals who make choices regarding adhesive bonding or who must work in adhesive...

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    $40.92 $93.00 -56% In stock
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    IPC 6903 Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry) Handbook / Manual / Guide by Association Connecting Electronics Industries, 10/01/2015 Full Description This standard provides industry-approved terms and...

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    IPC 6012D Qualification and Performance Specification for Rigid Printed Boards standard by Association Connecting Electronics Industries, 09/01/2015 Full Description This specification covers qualification and performance of rigid printed boards, including single-sided,...

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    IPC 6012DS Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards Amendment by Association Connecting Electronics Industries, 2015 Full Description This Addendum supplements or replaces...

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    $39.16 $89.00 -56% In stock
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    IPC WP-1081 White Paper on Conflict Minerals Due Diligence Guidance standard by Association Connecting Electronics Industries, 07/01/2015 Full Description This document is intended to provide downstream companies with practical examples for establishing a conflict...

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    $73.04 $166.00 -56% In stock
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    IPC 4101E Specification for Base Materials for Rigid and Multilayer Printed Boards standard by Association Connecting Electronics Industries, 07/01/2015 Full Description IPC 4101E covers the requirements for base materials that are referred to as laminate or prepreg....

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    IPC 4101D-WAM1 Specification for Base Materials for Rigid and Multilayer Printed Boards with Amendment 1 standard by Association Connecting Electronics Industries, 07/01/2015 Full Description IPC-4101D-WAM1 covers the requirements for base materials that are referred to...

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    IPC 6901 Application Categories for Printed Electronics standard by Association Connecting Electronics Industries, 07/01/2015 Full Description This standard establishes a Market Classification System and Level Classification System for printed electronics assemblies and...

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    IPC T-50M Terms and Definitions for Interconnecting and Packaging Electronic Circuits standard by Association Connecting Electronics Industries, 05/01/2015 Full Description This essential industry standard provides descriptions and illustrations of electronic...

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    IPC 9702-WAM1 Monotonic Bend Characterization of Board-Level Interconnects with Amendment 1 standard by Association Connecting Electronics Industries, 05/01/2015 Full Description This publication is intended to characterize the frature strength of a component's board...

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    IPC 7801 Reflow Oven Process Control Standard standard by Association Connecting Electronics Industries, 03/01/2015 Full Description IPC-7801 provides process control for solder reflow ovens by baseline and periodic verifications of oven profiles using a standard...

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Showing 709 - 720 of 1263 items