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    IPC 7621 Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics standard by Association Connecting Electronics Industries, 01/01/2018 Full Description Encapsulation, for...

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    IPC 7094A Design and Assembly Process Implementation for Flip Chip and Die-Size Components standard by Association Connecting Electronics Industries, 01/01/2018 Full Description IPC 7094A describes the design and assembly challenges for implementing flip chip technology...

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    IPC DRM-SMT-G Surface Mount Solder Joint Evaluation - Desk Reference Manual Handbook / Manual / Guide by Association Connecting Electronics Industries, 12/01/2017

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    IPC J-STD-002E Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires standard by Association Connecting Electronics Industries, 11/01/2017 Full Description This standard prescribes test methods, defect definitions, acceptance criteria, and...

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    IPC 4103B Specification for Base Materials for High Speed/High Frequency Applications standard by Association Connecting Electronics Industries, 11/01/2017 Full Description IPC 4103B covers the requirements for high speed/high frequency performance plastic substrates to...

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    IPC A-610G Acceptability of Electronic Assemblies standard by Association Connecting Electronics Industries, 10/31/2017 Full Description IPC-A-610 is the most widely used electronics assembly acceptance document. Updated with participants from 17 countries providing...

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    IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies standard by Association Connecting Electronics Industries, 10/31/2017 Full Description J-STD-001 is recognized globally for its criteria on soldering processes and materials. Updated with...

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    IPC J-STD-006C-AM1 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications - Amendment 1 Amendment by Association Connecting Electronics Industries, 10/01/2017 Full Description The J-STD-006C-AM1...

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    IPC 9505 Guideline Methodology for Assessing Component and Cleaning Materials Compatibility standard by Association Connecting Electronics Industries, 09/27/2017 Full Description The IPC-9505 standard provides details of test methodologies for cleaning chemistry...

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    IPC 6012D-WAM1 Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1 standard by Association Connecting Electronics Industries, 09/01/2017

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    IPC 6012D-AM1 Qualification and Performance Specification for Rigid Printed Boards - Amendment 1 Amendment by Association Connecting Electronics Industries, 09/01/2017

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    IPC J-STD-003C-WAM1&2 Solderability Tests for Printed Boards with Amendment 1&2 standard by Association Connecting Electronics Industries, 09/01/2017 Full Description The IPC-J-STD-003C-WAM1 Product Details Published: 09/01/2017...

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Showing 73 - 84 of 1263 items