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    IPC EMBPAS03 IPC International Conference on Embedded Passives "The Faster and Cleaner Electronic Signals for the Future" - Northbrook, IL - June 2003 Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003 Full Description Reducing...

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    IPC 5701 Users Guide for Cleanliness of Unpopulated Printed Boards standard by Association Connecting Electronics Industries, 07/01/2003 Full Description Tackling PCB cleanliness is a tough job; residues on printed circuit boards are directly related to the reliability...

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    IPC 2221A Generic Standard on Printed Board Design standard by Association Connecting Electronics Industries, 05/01/2003 Full Description IPC-2221A is the foundation design standard for all documents in the IPC-2220 series. It establishes the generic requirements for the...

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    IPC 2226 Sectional Design Standard for High Density Interconnect (HDI) Boards standard by Association Connecting Electronics Industries, 05/01/2003 Full Description Designers and manufacturers looking for the next level of guidance on building high density interconnect...

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    IPC 0040 Optoelectronics Assembly and Packaging Technology standard by Association Connecting Electronics Industries, 05/01/2003 Full Description This document addresses the implementation of optical and optoelectronic packaging technologies. The areas discussed include:...

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    IPC 8413-1 Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing standard by Association Connecting Electronics Industries, 04/01/2003 Full Description The purpose of this specification is to define standard practices for handling various...

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    IPC 9500-K Assembly Process Component Simulations, Guidelines and Classifications Package standard by Association Connecting Electronics Industries, 03/01/2003 Full Description Here's a convenient and cost effective way to own the complete set of process simulation...

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    IPC J-STD-027 Mechanical Outline Standard for Flip Chip or Chip Scale Configurations standard by Association Connecting Electronics Industries, 02/01/2003 Full Description THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip...

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    IPC J-STD-002B Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires standard by Association Connecting Electronics Industries, 02/01/2003 Full Description IPC/EIA/JEDEC J-STD-002B provides the tools to assess solderability of electronic...

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    IPC DVD-54C ESD Control with Training Certification Handbook / Manual / Guide by Association Connecting Electronics Industries, 11/01/2002 Full Description With optional English Subtitles for the hearing-imparied and English-as-a-Second-Language employees, DVD-54C...

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    $57.64 $131.00 -56% In stock
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    IPC D-356B Bare Substrate Electrical Test Data Format standard by Association Connecting Electronics Industries, 10/01/2002 Full Description This standard describes a data format for transmitting bare board electrical test information in digital form, including data...

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    IPC 4552 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards, includes Amendment 1 and 2 standard by Association Connecting Electronics Industries, 10/01/2002 Full Description Includes Amendment 1 (June 2012); English only.In...

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Showing 889 - 900 of 1263 items