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    IPC 4103 Specification for Base Materials for High Speed/High Frequency Applications standard by Association Connecting Electronics Industries, 01/01/2002 Full Description Covers the requirements for high speed / high frequency laminate or bonding layers to be used...

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    $34.76 $79.00 -56% In stock
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    IPC 2576 Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data - Product Data eXchange (PDX) standard by Association Connecting Electronics Industries, 11/01/2001 Full Description This standard covers the sectional...

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    $49.72 $113.00 -56% In stock
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    IPC 2578 Sectional Requirements for Supply Chain Communication of Bill of Material and Product Design Configuration Data - Product Data eXchange standard by Association Connecting Electronics Industries, 11/01/2001 Full Description his standard covers the sectional...

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    $49.72 $113.00 -56% In stock
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    IPC 2571 Generic Requirements for Electronic Manufacturing Supply Chain Communication - Product Data eXchange (PDX) standard by Association Connecting Electronics Industries, 11/01/2001 Full Description This standard defines an XML encoding schema that enables a total...

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    $65.12 $148.00 -56% In stock
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    IPC 2541 Generic Requirements for Electronics Manufacturing Shop Floor Equipment Communication (CAMX) standard by Association Connecting Electronics Industries, 10/01/2001 Full Description This standard defines an XML encoding schema to facilitate plug-and-play...

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    IPC 2546 Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Assembly - with Amendments 1 & 2 standard by Association Connecting Electronics Industries, 10/01/2001 Full Description This standard describes the event...

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    $46.20 $105.00 -56% In stock
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    IPC DLS-2001 Technical Proceedings for the Designers Learning Symposium - 2001 Conference Proceeding by Association Connecting Electronics Industries, 07/18/2001 Full Description The Designers Learning Symposium held its first conference in the Midwest in July 2001. The...

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    $57.64 $131.00 -56% In stock
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    IPC TR-486 Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations standard by Association Connecting Electronics Industries, 07/01/2001 Full Description...

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    $40.92 $93.00 -56% In stock
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    IPC 7530 Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes standard by Association Connecting Electronics Industries, 06/01/2001 Full Description During mass soldering, it is important that all solder joints reach the minimum soldering...

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    $18.48 $42.00 -56% In stock
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    IPC 4411-K Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement, with Amendment 1 standard by Association Connecting Electronics Industries, 03/01/2001 Full Description IPC-4411 covers the nomenclature, definitions and requirements for...

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    $14.08 $32.00 -56% In stock
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    IPC 4411-AM1 Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement, Amendment 1 Amendment by Association Connecting Electronics Industries, 03/01/2001 Full Description IPC-4411 covers the nomenclature, definitions and requirements for...

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    IPC 2512A Sectional Requirements for Implementation of Administrative Methods for Mfg. Data Description standard by Association Connecting Electronics Industries, 11/01/2000 Full Description This standard is the sectional requirement for implementation of administration...

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Showing 925 - 936 of 1263 items