IPC 7525B Stencil Design Guidelines

standard by Association Connecting Electronics Industries, 10/01/2011

Full Description

This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs.

Product Details

Published: 10/01/2011 Number of Pages: 36 File Size: 1 file , 2.1 MB