IPC 9707 Spherical Bend Test Method for Characterization of Board Level Interconnects

standard by Association Connecting Electronics Industries, 09/01/2011

Full Description

This standard on spherical transient bend testing is intended to characterize the maximum allowable strain that a surface mount component's board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that can occur during conventional printed board/system assembly, manufacturing and test operations. This method is applicable to surface mounted BGA components larger than 15.0 mm on a side with organically based substrates, attached to printed boards using conventional solder reflow technologies. This document was developed cooperatively with JEDEC.

Product Details

Published: 09/01/2011 Number of Pages: 24 File Size: 1 file , 2.4 MB