IPC 2614 Sectional Requirements for Board Fabrication Documentation

standard by Association Connecting Electronics Industries, 03/01/2010

Full Description

This standard establishes the requirements for the documentation of printed circuit board fabrication, and identifies the physical attributes and performance requirements of the unpopulated product. The descriptions apply to rigid, flexible, inorganic substrates or any combination thereof. The construction may be single, double, multilayered, or HDI technology and may include embedded (integrated) components. The requirements pertain to both hard copy and electronic data descriptions.

Product Details

Published: 03/01/2010 Number of Pages: 59 File Size: 1 file , 2.3 MB