IPC 4563 Resin Coated Copper Foil for Printed Boards Guideline

standard by Association Connecting Electronics Industries, 11/01/2007

Full Description

This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.

Product Details

Published: 11/01/2007 Number of Pages: 19 File Size: 1 file , 270 KB