IPC 4104 Specifications for High Density Interconnect (HDI) and Microvia Materials

standard by Association Connecting Electronics Industries, 05/01/1999

Full Description

Covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias.The 23 specification sheets included in IPC/JPCA-4104 specify the qualification and conformance requirements for such materials as photoimageable dielectric dry films and liquids, epoxy blends and coated foils. IPC/JPCA-4104 also includes six new test methods developed specifically for the testing of HDI and microvia materials.

Product Details

Published: 05/01/1999 ANSI: ANSI Approved Number of Pages: 100 File Size: 1 file , 440 KB Product Code(s): 4104(D)1