IPC 2225 Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)

standard by Association Connecting Electronics Industries, 05/01/1998

Full Description

This standard establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module (SCM-L), MCM or MCM-L assemblies. Key concepts include adhesive interconnection information, typical die attach materials, microvia material properties, relationships with DFM and DFE.

Product Details

Published: 05/01/1998 ANSI: ANSI Approved Number of Pages: 44 File Size: 1 file , 590 KB Product Code(s): 2225(D)1