IPC 6015 Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures

standard by Association Connecting Electronics Industries, 02/01/1998

Full Description

This specification establishes the specific requirements for organic mounting structures used to interconnect chip components, which in combination form the completed functional organic single-chip module (SCM-L) or organic multichip module (MCM-L) assembly and the quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6011.

Product Details

Published: 02/01/1998 Number of Pages: 25 File Size: 1 file , 1.2 MB Product Code(s): 6015(D)1