IPC J-STD-013 Implementation of Ball Grid Array and Other High Density Technology

standard by Association Connecting Electronics Industries, 08/01/1996

Full Description

This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Co-produced with EIA, MCNC and Sematech.

Product Details

Published: 08/01/1996 Number of Pages: 123 File Size: 1 file , 1.3 MB Product Code(s): J-013(D)1