IPC DD-135 Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules

standard by Association Connecting Electronics Industries, 08/01/1995

Full Description

This standard has been written for deposited organic interlayer dielectric materials under evaluation for MCM-D applications. The standard and test methods have been written without bias towards any particular class of materials.

Product Details

Published: 08/01/1995 Number of Pages: 36 File Size: 1 file , 370 KB Product Code(s): DD-135(D)1