IPC J-STD-005 Requirements for Soldering Pastes, Includes Amendment 1 (2007)

standard by Association Connecting Electronics Industries, 01/01/1995

Full Description

Lists general requirements for characterization and test of metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. (This is a quality control document and is not intended to relate directly to a material's performance in the manufacturing process). Supersedes QQ-S-571.

Product Details

Published: 01/01/1995 ANSI: ANSI Approved Number of Pages: 38 Part of: IPC A-20/21-GKIT