IPC J-STD-003 Solderability Tests for Printed Boards

standard by Association Connecting Electronics Industries, 04/01/1992

Full Description

Contains industry-recommended test methods, defect definitions and illustrations for suppliers and users to assess the solderability of printed board surface conductors, lands and plated through-holes. Test methods covered include edge dip, rotary dip, solder float, wave solder and wetting balance.

Product Details

Published: 04/01/1992 Number of Pages: 15