IPC SM-839 Pre and Post Solder Mask Application Cleaning Guidelines

standard by Association Connecting Electronics Industries, 04/01/1990

Full Description

Covers all aspects of cleaning related to solder mask application, including board preparation, in-process control and maintenance of cleanliness during pre-assembly processes.

Product Details

Published: 04/01/1990 Number of Pages: 29 File Size: 1 file , 130 KB Product Code(s): SM-839(D)1