IPC D-859 Design Standard for Thick Film Multilayer Hybrid Circuits

standard by Association Connecting Electronics Industries, 12/01/1989

Full Description

This standard covers the requirements and considerations for the design of multilayer hybrid circuits based on industry manufacturing capabilities.

Product Details

Published: 12/01/1989 Number of Pages: 67 File Size: 1 file , 1 MB Product Code(s): D-859(D)1