IPC J-STD-033D Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

standard by Association Connecting Electronics Industries, 03/01/2018

Full Description

IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033D procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.

Product Details

Published: 03/01/2018 Number of Pages: 32 File Size: 1 file , 910 KB Product Code(s): J033-STD-0-D-0-EN-D, J033-STD-0-D-0-EN-D