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IPC 2581B Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology standard by Association Connecting Electronics Industries, 09/01/2013 Full Description This standard specifies the XML schema that represents the...
IPC A-630 Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures standard by Association Connecting Electronics Industries, 09/01/2013 Full Description This standard is the first of its kind for IPC; the first acceptability standard for...
IPC HDBK-830A Guidelines for Design, Selection and Application of Conformal Coatings Handbook / Manual / Guide by Association Connecting Electronics Industries, 08/01/2013 Full Description This handbook is a compilation of the conformal coating industry's practical...
IPC J-STD-006C Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications standard by Association Connecting Electronics Industries, 07/01/2013 Full Description IPC J-STD-006C prescribes the nomenclature,...
IPC 2291 Design Guideline for Printed Electronics standard by Association Connecting Electronics Industries, 06/01/2013 Full Description This guideline provides an overview of the design process flow for printed electronics based devices, modules and units, and final...
IPC T-50K Terms and Definitions for Interconnecting and Packaging Electronic Circuits standard by Association Connecting Electronics Industries, 06/01/2013 Full Description This essential industry standard provides descriptions and illustrations of electronic...
IPC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires standard by Association Connecting Electronics Industries, 06/01/2013 Full Description This standard prescribes test methods, defect definitions, acceptance criteria, and...
IPC 9641 High Temperature Printed Board Flatness Guideline standard by Association Connecting Electronics Industries, 06/01/2013 Full Description Printed board flatness is largely affected by a change in intrinsic properties through exposure to variances in temperature....
IPC 4412B Specification for Finished Fabric Woven from "E" Glass for Printed Boards standard by Association Connecting Electronics Industries, 05/01/2013 Full Description IPC-4412B exhaustively covers the classification and requirements for finished fabrics...
IPC 5703 Cleanliness Guidelines for Printed Board Fabricators standard by Association Connecting Electronics Industries, 05/01/2013 Full Description Printed board cleanliness has historically been an unknown factor in the quality assessment of unpopulated (bare) printed...
IPC 4203A Cover and Bonding Material for Flexible Printed Circuitry standard by Association Connecting Electronics Industries, 01/01/2013 Full Description This standard establishes the classification system, the qualification and quality conformance requirements for...
IPC 7095C Design and Assembly Process Implementation for BGAs standard by Association Connecting Electronics Industries, 01/01/2013 Full Description Implementing ball grid array (BGA) and fine-pitch ball grid array (FBGA) technology presents some unique challenges for...