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    IPC 4556 Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards standard by Association Connecting Electronics Industries, 01/01/2013 Full Description This specification sets the requirements for the use of...

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    IPC 4552-WAM1-2 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards with Amendments 1 and 2 standard by Association Connecting Electronics Industries, 12/01/2012 Full Description In answer to numerous industry requests for...

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    IPC 4591 Requirements for Printed Electronics Functional Conductive Materials standard by Association Connecting Electronics Industries, 11/01/2012 Full Description This document provides comprehensive data to help users more easily determine material performance,...

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    IPC 1751A(D)F Generic Requirements for Declaration Process Management, Includes Amendment 1 Amendment by Association Connecting Electronics Industries, 11/01/2012 Full Description Amendment 1 to IPC-1751A standard provides the principles and details for declarations...

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    IPC 9592B Requirements for Power Conversion Devices for the Computer and Telecommunications Industries standard by Association Connecting Electronics Industries, 11/01/2012 Full Description This document standardizes the requirements for power conversion devices (PCDs)...

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    IPC 2221B Generic Standard on Printed Board Design standard by Association Connecting Electronics Industries, 11/01/2012 Full Description IPC-2221B is the foundation design standard for all documents in the IPC-2220 series. It establishes the generic requirements for the...

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    IPC A-620B Requirements and Acceptance for Cable and Wire Harness Assemblies with Amendment 1 standard by Association Connecting Electronics Industries, 10/01/2012 Full Description Includes greatly expanded criteria for molding, potting, splicing, crimp contacts without...

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    IPC 4554 Amendment 1 Amendment 1 to Specification for Immersion Tin Plating for Printed Circuit Boards Amendment by Association Connecting Electronics Industries, 08/01/2012

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    IPC 1758 Declaration Requirements for Shipping, Pack and Packing Materials. standard by Association Connecting Electronics Industries, 07/01/2012 Full Description IPC-1758 establishes a standard reporting format for pack and packing material declaration data exchange...

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    IPC HDBK-850 Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly standard by Association Connecting Electronics Industries, 07/01/2012 Full Description This handbook has...

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    IPC 4552 Amendment 1 Amendment 1 to Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards Amendment by Association Connecting Electronics Industries, 06/01/2012

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    IPC A-620AS Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A Requirements and Acceptance for Cable and Wire Harness Assemblies Amendment by Association Connecting Electronics Industries, 06/01/2012

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Showing 385 - 396 of 1263 items