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    IPC J-STD-001B [ Withdrawn ] Requirements for Soldered Electrical and Electronic Assemblies standard by Association Connecting Electronics Industries, 01/01/1995 Full Description Supersedes IPC-S-815. Prescribes materials, methods and verification criteria...

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    IPC J-STD-005 Requirements for Soldering Pastes, Includes Amendment 1 (2007) standard by Association Connecting Electronics Industries, 01/01/1995 Full Description Lists general requirements for characterization and test of metal content, viscosity, slump, solder ball,...

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    IPC CA-821 General Requirements for Thermally Conductive Adhesives standard by Association Connecting Electronics Industries, 01/01/1995 Full Description Covers requirements and test methods for paste type dielectric adhesives used to bond components in place and for...

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    IPC DW-424 General Specification for Encapsulated Discrete Wire Interconnection Boards standard by Association Connecting Electronics Industries, 01/01/1995 Full Description This specification establishes the qualification and performance requirements for encapsulated...

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    $57.64 $131.00 -56% In stock
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    IPC D-355 Printed Board Automated Assembly Description in Digital Form standard by Association Connecting Electronics Industries, 01/01/1995 Full Description Describes an intelligent, digital data transfer format for describing component mounting information....

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    IPC A-610B [ Withdrawn ] Acceptability of Printed Board Assemblies - Incorporates Amendment 1 standard by Association Connecting Electronics Industries, 12/01/1994 Full Description A must for all quality assurance departments, IPC-A-610B illustrates...

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    IPC TR-582 Cleaning and Cleanliness Testing Program for: Phase - Low Solids Fluxes and Pastes Processed in Ambient Air standard by Association Connecting Electronics Industries, 11/01/1994

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    IPC TR-581 IPC Phase 3 Controlled Atmosphere Soldering Study standard by Association Connecting Electronics Industries, 08/01/1994

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    IPC ML-960 Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed Boards standard by Association Connecting Electronics Industries, 07/01/1994

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    IPC DR-570A General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards standard by Association Connecting Electronics Industries, 04/01/1994 Full Description Establishes definitions for terms and requirements for solid carbide twist drills with...

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    IPC CI-408 Solderless Surface Mount Connectors Design Characteristics and Application Guidelines Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1994 Full Description Provides information on design characteristics and the application of...

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    Composite Metallic Material Specification for Printed Wiring Boards Book by Association Connecting Electronics Industries, 01/01/1994 Full Description Covers the requirements for copper/invar/copper (CIC), copper/molybdenum/ copper (CMC) and three-layer composites for use in...

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Showing 409 - 420 of 1263 items