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    IPC J-STD-006C Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications standard by Association Connecting Electronics Industries, 07/01/2013 Full Description IPC J-STD-006C prescribes the nomenclature,...

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    IPC 2291 Design Guideline for Printed Electronics standard by Association Connecting Electronics Industries, 06/01/2013 Full Description This guideline provides an overview of the design process flow for printed electronics based devices, modules and units, and final...

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    IPC T-50K Terms and Definitions for Interconnecting and Packaging Electronic Circuits standard by Association Connecting Electronics Industries, 06/01/2013 Full Description This essential industry standard provides descriptions and illustrations of electronic...

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    IPC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires standard by Association Connecting Electronics Industries, 06/01/2013 Full Description This standard prescribes test methods, defect definitions, acceptance criteria, and...

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    IPC 9641 High Temperature Printed Board Flatness Guideline standard by Association Connecting Electronics Industries, 06/01/2013 Full Description Printed board flatness is largely affected by a change in intrinsic properties through exposure to variances in temperature....

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    IPC 4412B Specification for Finished Fabric Woven from "E" Glass for Printed Boards standard by Association Connecting Electronics Industries, 05/01/2013 Full Description IPC-4412B exhaustively covers the classification and requirements for finished fabrics...

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    IPC 5703 Cleanliness Guidelines for Printed Board Fabricators standard by Association Connecting Electronics Industries, 05/01/2013 Full Description Printed board cleanliness has historically been an unknown factor in the quality assessment of unpopulated (bare) printed...

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    IPC 4203A Cover and Bonding Material for Flexible Printed Circuitry standard by Association Connecting Electronics Industries, 01/01/2013 Full Description This standard establishes the classification system, the qualification and quality conformance requirements for...

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    IPC 7095C Design and Assembly Process Implementation for BGAs standard by Association Connecting Electronics Industries, 01/01/2013 Full Description Implementing ball grid array (BGA) and fine-pitch ball grid array (FBGA) technology presents some unique challenges for...

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    IPC 4556 Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards standard by Association Connecting Electronics Industries, 01/01/2013 Full Description This specification sets the requirements for the use of...

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    IPC 4552-WAM1-2 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards with Amendments 1 and 2 standard by Association Connecting Electronics Industries, 12/01/2012 Full Description In answer to numerous industry requests for...

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    IPC 4591 Requirements for Printed Electronics Functional Conductive Materials standard by Association Connecting Electronics Industries, 11/01/2012 Full Description This document provides comprehensive data to help users more easily determine material performance,...

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Showing 745 - 756 of 1263 items