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    IPC 9151D Process Capability, Quality and Relative Reliability (PQCR2) Benchmark Test Standard and Database standard by Association Connecting Electronics Industries, 05/01/2012 Full Description Many printed circuit board users have developed internal processes to...

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    IPC 7527 Requirements for Solder Paste Printing standard by Association Connecting Electronics Industries, 05/01/2012 Full Description This standard is a collection of visual qualityacceptability criteria for solder paste printing. Product...

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    IPC 2581 Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology standard by Association Connecting Electronics Industries, 05/01/2012 Full Description This standard specifies the XML schema that represents the...

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    IPC J-STD-004B-WAM1 Requirements for Soldering Fluxes standard by Association Connecting Electronics Industries, 02/28/2012 Full Description IPC J-STD-004B prescribes general requirements for the classification and characterization of fluxes for high quality solder...

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    IPC HDBK-001E Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies to Supplement ANSI/J-STD-001B Handbook / Manual / Guide by Association Connecting Electronics Industries, 02/01/2012 Full Description It describes materials, methods,...

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    IPC J-STD-005A Requirements for Soldering Pastes standard by Association Connecting Electronics Industries, 02/01/2012 Full Description This standard lists requirements for qualification and characterization of solder paste. It references test methods and criteria for...

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    IPC AJ-820A Assembly & Joining Handbook Handbook / Manual / Guide by Association Connecting Electronics Industries, 02/01/2012 Full Description This document provides guidelines and supporting information for manufacturing electronic assemblies. the content of this...

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    IPC J-STD-033C Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007) standard by Association Connecting Electronics Industries, 02/01/2012 Full Description Provides surface mount device manufacturers and users...

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    IPC 4554-WAM1 Specification for Immersion Tin Plating for Printed Circuit Boards with Amendment 1 standard by Association Connecting Electronics Industries, 01/01/2012 Full Description IPC-4554, Specification for Immersion Tin Plating for Printed Circuit Boards, is...

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    IPC 4103A Specification for Base Materials for High Speed/High Frequency Applications standard by Association Connecting Electronics Industries, 12/01/2011 Full Description This specification covers the requirements for clad and unclad plastic laminate and bonding layer...

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    IPC 9850A Surface Mount Placement Equipment Characterization standard by Association Connecting Electronics Industries, 11/01/2011 Full Description This standard establishes the procedures to characterize the capability of surface mount assembly equipment inspecification...

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    IPC 6018B Microwave End Product Board Inspection and Test standard by Association Connecting Electronics Industries, 11/01/2011 Full Description Establishes requirements for qualification and performance of high frequency (microwave) printed boards. Covers both end...

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Showing 769 - 780 of 1263 items