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    IPC 6013A Qualification and Performance Specification for Flexible Printed Boards, Includes Amendment 2 standard by Association Connecting Electronics Industries, 04/01/2006 Full Description Covers qualification and performance requirements for flexible printed boards...

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    IPC JP002 JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline standard by Association Connecting Electronics Industries, 03/01/2006 Full Description This document will provide insight into the theory behind tin whisker formation as it is known today...

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    IPC 9701A Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments standard by Association Connecting Electronics Industries, 02/01/2006 Full Description Provides specific test methods to evaluate the performance and reliability of...

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    IPC 4412A Specification for Finished Fabric Woven from "E" Glass for Printed Boards standard by Association Connecting Electronics Industries, 01/01/2006 Full Description Exhaustively covers the classification and requirements for finished fabrics woven from...

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    IPC J-STD-006B Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications standard by Association Connecting Electronics Industries, 01/01/2006 Full Description This standard prescribes the nomenclature,...

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    IPC HDBK-005 Guide to Solder Paste Assessment Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/2006 Full Description Provides specific test methods to evaluate the performance and reliability of surface mount solder attachments of...

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    IPC 8497-1 Cleaning Methods and Contamination Assessment for Optical Assembly standard by Association Connecting Electronics Industries, 01/01/2006 Full Description This standard describes the methods of inspecting and cleaning all optical interfaces so that...

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    IPC WP-008 Setting Up Ion Chromatography Capability standard by Association Connecting Electronics Industries, 12/01/2005 Full Description Ion chromatography has been recognized as a method for which the data output is ion specific and very precise in the quantification...

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    IPC J-STD-033B Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007) standard by Association Connecting Electronics Industries, 10/01/2005 Full Description Provides Surface Mount Device manufacturers and users...

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    IPC HDBK-001 Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies to Supplement ANSI/J-STD-001B Handbook / Manual / Guide by Association Connecting Electronics Industries, 10/01/2005 Full Description UPDATED with Amendments 1...

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    IPC J-STD-030 Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages standard by Association Connecting Electronics Industries, 09/01/2005 Full Description This document provides users of underfill material with guidance in...

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    IPC 4553 Specification for Immersion Silver Plating for Printed Circuit Boards standard by Association Connecting Electronics Industries, 06/01/2005 Full Description IPC-4553, Specification for Immersion Silver Plating for Printed Circuit Boards, is the second document...

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Showing 853 - 864 of 1263 items