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    IPC 7095B Design and Assembly Process Implementation for BGAs standard by Association Connecting Electronics Industries, 03/01/2008 Full Description Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for...

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    IPC DRM-18H Component Identification Training and Reference Guide standard by Association Connecting Electronics Industries, 12/01/2007 Full Description The Component Identification Training and Reference Guide is a valuable tool for employee training and quick...

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    $55.00 $125.00 -56% In stock
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    IPC J-STD-002C Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires, Includes Amendment 1 (November 2008) standard by Association Connecting Electronics Industries, 12/01/2007 Full Description This standard prescribes test methods, defect...

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    $140.36 $319.00 -56% In stock
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    IPC 7711/7721B Rework, Modification and Repair of Electronic Assemblies standard by Association Connecting Electronics Industries, 11/01/2007 Full Description Major update for lead free support and enhanced inspection guidelines for repairs and modifications!This guide...

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    $40.92 $93.00 -56% In stock
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    IPC 4563 Resin Coated Copper Foil for Printed Boards Guideline standard by Association Connecting Electronics Industries, 11/01/2007 Full Description This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density...

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    $73.92 $168.00 -56% In stock
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    IPC 9201A Surface Insulation Resistance Handbook standard by Association Connecting Electronics Industries, 09/01/2007 Full Description Surface Insulation Resistance (SIR) testing is a tool used not only for characterization testing of production processes such as solder...

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    $39.16 $89.00 -56% In stock
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    IPC J-STD-020D Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices standard by Association Connecting Electronics Industries, 08/01/2007 Full Description Updated with extended support for components used for lead free assembly!...

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    $52.80 $120.00 -56% In stock
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    IPC TR-584A IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Printed Circuit Boards and Assemblies (Correcting the Misunderstandings on "Halogen-Free") standard by Association Connecting Electronics Industries, 08/01/2007 Full Description...

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    IPC 5702 Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards standard by Association Connecting Electronics Industries, 06/01/2007 Full Description Every electronics manufacturer, whether an original equipment manufacturer...

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    $39.16 $89.00 -56% In stock
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    IPC J-STD-609 Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Pb-Free and Other Attributes standard by Association Connecting Electronics Industries, 05/01/2007 Full Description This standard provides a marking and labeling system that aids in...

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    $27.72 $63.00 -56% In stock
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    IPC SM-840D Qualification and Performance Specification of Permanent Solder Mask standard by Association Connecting Electronics Industries, 04/01/2007 Full Description Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the...

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    IPC J-STD-003B Solderability Tests for Printed Boards standard by Association Connecting Electronics Industries, 03/01/2007 Full Description This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board...

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Showing 829 - 840 of 1263 items