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    IPC 2612-1 Sectional Requirements for Electronic Diagramming Symbol Generation Methodology standard by Association Connecting Electronics Industries, 03/01/2010 Full Description This standard establishes the requirements for generation of electronic symbols used in the...

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    IPC 2612 Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions) standard by Association Connecting Electronics Industries, 03/01/2010 Full Description This standard establishes the requirements for the documentation of...

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    IPC 2614 Sectional Requirements for Board Fabrication Documentation standard by Association Connecting Electronics Industries, 03/01/2010 Full Description This standard establishes the requirements for the documentation of printed circuit board fabrication, and...

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    IPC 1751A Generic Requirements for Declaration Process Management standard by Association Connecting Electronics Industries, 02/01/2010 Full Description IPC-1751A standard provides the principles and details for declarations necessary between members of a supply chain...

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    IPC 5704 Cleanliness Requirements for Unpopulated Printed Boards standard by Association Connecting Electronics Industries, 01/01/2010 Full Description Printed board quality encompasses many parameters, cleanliness being one important parameter. This document defines the...

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    IPC 2152 Standard for Determining Current Carrying Capacity in Printed Board Design standard by Association Connecting Electronics Industries, 08/01/2009 Full Description The sole industry standard for determining appropriate internal and external conductor sizes on...

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    IPC 4101C Specification for Base Materials for Rigid and Multilayer Printed Boards standard by Association Connecting Electronics Industries, 08/01/2009 Full Description This specification covers the requirements for base materials that are referred to as laminate or...

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    IPC 4553A Specification for Immersion Silver Plating for Printed Boards standard by Association Connecting Electronics Industries, 05/01/2009 Full Description This specification sets requirements based on performance criteria for the use of Immersion Silver (IAg) as a...

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    IPC 6017 Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices standard by Association Connecting Electronics Industries, 03/01/2009 Full Description IPC 6017 supplements existing IPC-6010 series specifications with...

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    IPC WP-009 A Summary of Tin Whisker Research References standard by Association Connecting Electronics Industries, 03/01/2009 Full Description As most of the world converts to lead-free manufacturing, the concern over tin whiskers as a reliability hazard has grown due to...

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    IPC 9703 Mechanical Shock Test Guidelines for Solder Joint Reliability standard by Association Connecting Electronics Industries, 03/01/2009 Full Description Establishes mechanical drop and shock and test guidelines for assessing solder joint reliability of printed board...

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    IPC 7094 Design and Assembly Process Implementation for Flip Chip and Die Size Components standard by Association Connecting Electronics Industries, 02/01/2009 Full Description Implementing flip chip technology in a direct chip attach (DCA) assembly presents some unique...

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Showing 805 - 816 of 1263 items