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    IPC J-STD-020A Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices standard by Association Connecting Electronics Industries, 04/01/1999 Full Description The purpose of this standard is to identify the classification level of...

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    IPC J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components standard by Association Connecting Electronics Industries, 04/01/1999 Full Description This test method defines the procedures for performing acoustic microscopy on nonhermetic...

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    IPC J-STD-033 Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices standard by Association Connecting Electronics Industries, 04/01/1999 Full Description Provides SMD manufacturers and users with standardized methods for...

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    $52.80 $120.00 -56% In stock
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    IPC J-STD-028 Performance Standard fo Construction of Flip Chip and Chip Scale Bumps standard by Association Connecting Electronics Industries, 04/01/1999 Full Description This new standard establishes construction detail requirements for bumps and other terminal...

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    IPC J-STD-026 Semiconductor Design Standard for Flip Chip Applications standard by Association Connecting Electronics Industries, 04/01/1999 Full Description This new standard addresses semiconductor flip chip design requirements. Provides information intended for...

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    $25.52 $58.00 -56% In stock
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    IPC 9503 Moisture Sensitivity Classification for Non-IC Components standard by Association Connecting Electronics Industries, 04/01/1999 Full Description The purpose of this standard is to identify the moisture sensitivity classification level of passive surface mount...

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    $40.92 $93.00 -56% In stock
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    IPC 9502 PWB Assembly Soldering Process Guideline for Electronic Components standard by Association Connecting Electronics Industries, 04/01/1999 Full Description This document describes manufacturing solder process limits that components subjected to IPC-9501, IPC-9504...

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    IPC 4411 Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement standard by Association Connecting Electronics Industries, 04/01/1999 Full Description Covers the requirements and determines the nomenclature, definitions and physical...

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    IPC EXPO-99 IPC Printed Circuits Expo 99 Proceedings standard by Association Connecting Electronics Industries, 03/01/1999 Full Description IPC Printed Circuits Expo is the premier technical conference and trade exposition for the printed wiring board manufacturing...

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    $73.92 $168.00 -56% In stock
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    IPC QE-605A Printed Board Quality Evaluation Handbook standard by Association Connecting Electronics Industries, 02/01/1999 Full Description This document contains a wide variety of photographic illustrations of various anomalies and characteristics of printed boards...

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    IPC 2524 PWB Fabrication Data Quality Rating System standard by Association Connecting Electronics Industries, 02/01/1999 Full Description This document describes a PWB fabrication data quality rating system used by fabricators to evaluate the incoming data package...

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    $70.40 $160.00 -56% In stock
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    IPC CH-65A Guidelines for Cleaning of Printed Boards and Assemblies Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1999 Full Description A road map for current and emerging cleaning issues in the electronics industry. This handbook...

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Showing 973 - 984 of 1263 items