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    $51.04 $116.00 -56% In stock
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    IPC FLEX-CO-99 IPC National Conference Flexible Circuits Volume I & II - Denver, CO 1999 Conference Proceeding by Association Connecting Electronics Industries, 01/01/1999 Full Description Fine line, multilayer circuits and flex-based IC packages are big players in...

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    IPC BET-99 National Conference on Bare Board and Advanced Substrate Electrical Test: HDI's Holy Grail Proceedings Conference Proceeding by Association Connecting Electronics Industries, 01/01/1999 Full Description Pitch, volume and density are bedeviling the bare...

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    $92.40 $210.00 -56% In stock
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    IPC TMRC99R TMRC 1999 Market for Flexible Circuits - TMRC99F Report / Survey by Association Connecting Electronics Industries, 01/01/1999 Full Description This 50+ page report details trends in conductor width and spacing, hole processing, electrical and optical testing,...

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    $65.12 $148.00 -56% In stock
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    IPC TP-1115 Selection and Implementation Strategy for a Low-Residue, No-Clean Process standard by Association Connecting Electronics Industries, 12/01/1998 Full Description This document provides direction to electronics manufacturers interested in adopting low residue...

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    $34.76 $79.00 -56% In stock
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    IPC EAE-98 Electronics Assembly Expo 1998 standard by Association Connecting Electronics Industries, 11/01/1998 Full Description Proceedings from Electronics Assembly Expo held October 27-29, 1998, Providence, RI. Selected by the industry program committee, these 60...

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    $20.68 $47.00 -56% In stock
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    Resin Coated Metal Foil for Printed Boards Book by Association Connecting Electronics Industries, 09/01/1998 Full Description This document establishes the requirements for metal foils coated with a resin or composite of resins on one side which are to be used for the fabrication...

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    $40.92 $93.00 -56% In stock
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    IPC 4130 Specification and Characterization Methods for Nonwoven "E" Glass Materials standard by Association Connecting Electronics Industries, 09/01/1998 Full Description Determines the nomenclature, definitions and physical requirements for mat made from...

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    IPC 4110 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards standard by Association Connecting Electronics Industries, 08/01/1998 Full Description Determines the nomenclature and general, chemical and physical requirements of...

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    $39.16 $89.00 -56% In stock
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    IPC 9504 Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components) standard by Association Connecting Electronics Industries, 06/01/1998 Full Description This document is another in a series and specifically addresses...

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    $57.64 $131.00 -56% In stock
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    IPC 2225 Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies) standard by Association Connecting Electronics Industries, 05/01/1998 Full Description This standard establishes the requirements and other considerations (thermal, electrical,...

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    $161.92 $368.00 -56% In stock
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    IPC VT-89 Bare Board Electrical Test - VIDEO standard by Association Connecting Electronics Industries, 04/01/1998 Full Description Visual overview of the principles of final electrical testing for PWBs, including: process descriptions for bed-of-nails electrical...

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    $140.36 $319.00 -56% In stock
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    IPC 7711/7721 Rework of Electronic Assemblies & Repair and Modification of Printed Boards and Electronic Assemblies standard by Association Connecting Electronics Industries, 04/01/1998 Full Description Everything you need on repair and rework of electronic...

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Showing 985 - 996 of 1263 items