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  • IPC A-610B-CD [ Withdrawn ] Acceptability of Electronic Assemblies on CD-ROM standard by Association Connecting Electronics Industries, 10/01/1996

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    IPC D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies Handbook / Manual / Guide by Association Connecting Electronics Industries, 08/01/1996 Full Description Establishes design concepts, guidelines and procedures for reliable printed...

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  • IPC AJ-820 Assembly & Joining Handbook Handbook / Manual / Guide by Association Connecting Electronics Industries, 08/01/1996 Full Description This document provides guidelines and supporting information for manufacturing electronic assemblies. the content of this...

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    IPC J-STD-013 Implementation of Ball Grid Array and Other High Density Technology standard by Association Connecting Electronics Industries, 08/01/1996 Full Description This document establishes the requirements and interactions necessary for printed board assembly...

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    IPC 3406 Guidelines for Electrically Conductive Surface Mount Adhesives standard by Association Connecting Electronics Industries, 07/01/1996 Full Description The IPC-3406 covers guidelines for selecting electrically conductive adhesives for use in assembly of components...

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    $39.16 $89.00 -56% In stock
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    IPC 6011 Generic Performance Specification for Printed Boards standard by Association Connecting Electronics Industries, 07/01/1996 Full Description Supersedes IPC-RB-276 - This specification establishes the general requirements and responsibilities for suppliers and...

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    IPC TP-1090 The Layman's Guide to Qualifying New Fluxes for MIL-STD-2000A or MT-0002 Handbook / Manual / Guide by Association Connecting Electronics Industries, 07/01/1996

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    IPC TR-465-3 Evaluation of Steam Aging on Alternative Finishes, Phase 11A standard by Association Connecting Electronics Industries, 07/01/1996 Full Description Details the results of a two-year study to determine the effect of steam aging exposure on components. A...

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  • IPC A-610B Amendment 1 [ Withdrawn ] Acceptability of Printed Board Assemblies Amendment by Association Connecting Electronics Industries, 04/01/1996 Full Description Incorporated into IPC A-610B Product Details...

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    IPC A-311 Process Controls for Phototool Generation and Use standard by Association Connecting Electronics Industries, 03/01/1996 Full Description Provides the information and data that can be collected during the generation and use of phototools to improve artwork...

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    IPC J-STD-012 Implementation of Flip Chip and Chip Scale Technology standard by Association Connecting Electronics Industries, 01/01/1996 Full Description This informative document describes the implementation of flip chip and related chip scale semiconductor packaging...

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    IPC SM-840C Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards, Includes Amendment 1 standard by Association Connecting Electronics Industries, 01/01/1996 Full Description Streamlines solder mask classes into two classifications:...

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Showing 1009 - 1020 of 1263 items