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    IPC AC-62A [ Withdrawn ] Post Solder Aqueous Cleaning Handbook Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1996 Full Description Describes manufacturing residues, types and properties of aqueous cleaning agents, aqueous...

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    IPC DD-135 Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules standard by Association Connecting Electronics Industries, 08/01/1995 Full Description This standard has been written for deposited organic interlayer dielectric...

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    IPC 9501 PWB Assembly Process Simulation for Evaluation of Electronic Components standard by Association Connecting Electronics Industries, 07/10/1995 Full Description Will the components work with your process? That determination is the goal of these manufacturing...

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    $57.64 $131.00 -56% In stock
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    IPC DW-425A Design and End Product Requirements for Discrete Wiring Boards standard by Association Connecting Electronics Industries, 05/01/1995 Full Description This specification establishes the qualification and performance requirements for encapsulated discrete wire...

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    IPC D-325A Documentation Requirements for Printed Boards standard by Association Connecting Electronics Industries, 05/01/1995 Full Description Establishes the general requirements for the documentation necessary to fully describe end product printed boards, regardless...

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    $34.76 $79.00 -56% In stock
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    IPC TR-466 Technical Report: Wetting Balance Standard Weight Comparison Test standard by Association Connecting Electronics Industries, 04/01/1995

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    $65.12 $148.00 -56% In stock
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    IPC J-STD-001B [ Withdrawn ] Requirements for Soldered Electrical and Electronic Assemblies standard by Association Connecting Electronics Industries, 01/01/1995 Full Description Supersedes IPC-S-815. Prescribes materials, methods and verification criteria...

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    IPC J-STD-005 Requirements for Soldering Pastes, Includes Amendment 1 (2007) standard by Association Connecting Electronics Industries, 01/01/1995 Full Description Lists general requirements for characterization and test of metal content, viscosity, slump, solder ball,...

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    IPC CA-821 General Requirements for Thermally Conductive Adhesives standard by Association Connecting Electronics Industries, 01/01/1995 Full Description Covers requirements and test methods for paste type dielectric adhesives used to bond components in place and for...

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    IPC DW-424 General Specification for Encapsulated Discrete Wire Interconnection Boards standard by Association Connecting Electronics Industries, 01/01/1995 Full Description This specification establishes the qualification and performance requirements for encapsulated...

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    IPC D-355 Printed Board Automated Assembly Description in Digital Form standard by Association Connecting Electronics Industries, 01/01/1995 Full Description Describes an intelligent, digital data transfer format for describing component mounting information....

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    IPC A-610B [ Withdrawn ] Acceptability of Printed Board Assemblies - Incorporates Amendment 1 standard by Association Connecting Electronics Industries, 12/01/1994 Full Description A must for all quality assurance departments, IPC-A-610B illustrates...

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Showing 1021 - 1032 of 1263 items