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IPC SM-784 Guidelines for Chip-on-Board Technology Implementation standard by Association Connecting Electronics Industries, 11/01/1990 Full Description Discusses chip types, board selection, design issues and thermal transfer methods for Chip on Board (COB)...
IPC MB-380 Guidelines for Molded Interconnection Devices Handbook / Manual / Guide by Association Connecting Electronics Industries, 10/01/1990
IPC ET-652 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards standard by Association Connecting Electronics Industries, 10/01/1990 Full Description Provides information to assist in selecting the test analyzer, test parameters, test data...
IPC A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards standard by Association Connecting Electronics Industries, 06/01/1990 Full Description Covers finished fabrics woven from aramid yarns that are intended as reinforcing material in laminated...
IPC L-108B [ Withdrawn ] Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards standard by Association Connecting Electronics Industries, 06/01/1990
IPC SM-839 Pre and Post Solder Mask Application Cleaning Guidelines standard by Association Connecting Electronics Industries, 04/01/1990 Full Description Covers all aspects of cleaning related to solder mask application, including board preparation, in-process control...
IPC 9201 Surface Insulation Resistance Handbook standard by Association Connecting Electronics Industries, 04/01/1990 Full Description Covers all aspects of cleaning related to solder mask application, including board preparation, in-process control and maintenance of...
IPC C-406 Design and Application Guidelines for Surface Mount Connectors standard by Association Connecting Electronics Industries, 01/01/1990 Full Description Provides guidelines for the design, selection and application of soldered surface mount connectors for all...
IPC D-859 Design Standard for Thick Film Multilayer Hybrid Circuits standard by Association Connecting Electronics Industries, 12/01/1989 Full Description This standard covers the requirements and considerations for the design of multilayer hybrid circuits based on...
IPC SM-817 General Requirements for Dielectric Surface Mounting Adhesives standard by Association Connecting Electronics Industries, 11/01/1989 Full Description Covers requirements for dielectric adhesives. Includes test methods to ensure components adhere to the board...
IPC TR-580 Cleaning and Cleanliness Test Program Phase 1 Test Results standard by Association Connecting Electronics Industries, 10/01/1989
IPC PD-335 Electronic Packaging Handbook standard by Association Connecting Electronics Industries, 01/01/1989 Full Description Contains a general introduction of electronic packaging followed by system integration; electronic equipment subsystems; subsystem...